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深圳市德普微电子有限公司成立于2006年4月，注册资本1000万；坐落于深圳市南山区高新园，主营集成电路设计，封装测试及销售业务。

德普微具备实现年产值5亿元人民币，年出货30亿块集成电路的能力。 德普微采用外发富士通封测加工和自建生产基地模式，生产基地采购业界顶尖生产测试设备，如：ASM AD838固晶机，K&S键合机，郎诚模具及切筋成型系统，等先进设备。

德普微积极致力于民族微电子产业的可持续发展，运用高新技术领域的专业经验，为建设和谐、效率社会提供卓越品质的产品和系统解决方案，实现整个产业链的共赢。

Shenzhen Developer Microelectronics CO., LTD was founded in April 2006, with a registered capital of RMB10 Million, and is located in High-Tech Park. The major businesses are IC design, packaging, test and sales. Till the end of  Last year our company achieved an annual turnover of over RMB5 billion.

Shenzhen Developer Microelectronics CO.,LTD has own packaging factory, located in Sichuan, named Sichuan Lippxin Microelectronics CO.,LTD. We finish packaging process at our own factory and Fujitsu as well. For our own package factory, we use the most advanced test equipment. Such as, ASM AD838 solid crystal machine, K&S bonding machine, Lang Cheng Die Mold and Cutting Molding system. The annual supply is up to 30 billion.